Total Records: 2608 - Showing maximum 50 Records per page

H1B Salary Details For RAYMOND, OH

Records Per Page

H1B Salary Details For RAYMOND, OH has minimum salary 46700 and maximum salary 1030596 from 2608 records.

Employer Job Title City Salary Year
PROLIM CONSULTING INC PLM Systems Engineer/Architect RAYMOND, OH 163520 3 2026 Show Top H1B Job Titles
PROLIM CONSULTING INC PLM Systems Engineer/Architect RAYMOND, OH 163520 3 2026 Show Top H1B Job Titles
HONDA DEVELOPMENT & MANUFACTURING OF AMERICA LLC Development Research Sr. Principal Engineer RAYMOND, OH 148000 2026 Show Top H1B Job Titles
SOLIZE USA CORPORATION PROJECT ENGINEER RAYMOND, OH 147460 3 2026 Show Top H1B Job Titles
HCL AMERICA INC TECHNICAL MANAGER RAYMOND, OH 130000 2026 Show Top H1B Job Titles
VEENUS INFOTECHS CORPORATION MECHANICAL DESIGN ENGINEER RAYMOND, OH 123224 3 2026 Show Top H1B Job Titles
TOOGANN TECHNOLOGIES LLC SR. CAE ENGINEER RAYMOND, OH 120016 2026 Show Top H1B Job Titles
HONDA DEVELOPMENT & MANUFACTURING OF AMERICA LLC Mechanical Design Principal Engineer RAYMOND, OH 120000 2026 Show Top H1B Job Titles
VEENUS INFOTECHS CORPORATION MECHANICAL DESIGN ENGINEER RAYMOND, OH 116800 3 2026 Show Top H1B Job Titles
VEENUS INFOTECHS CORPORATION MECHANICAL DESIGN ENGINEER RAYMOND, OH 116800 3 2026 Show Top H1B Job Titles
VEENUS INFOTECHS CORPORATION MECHANICAL DESIGN ENGINEER RAYMOND, OH 116800 3 2026 Show Top H1B Job Titles
VEENUS INFOTECHS CORPORATION MECHANICAL CAE ENGINEER RAYMOND, OH 116800 3 2026 Show Top H1B Job Titles
VEENUS INFOTECHS CORPORATION MECHANICAL ENGINEER RAYMOND, OH 116800 3 2026 Show Top H1B Job Titles
VEENUS INFOTECHS CORPORATION MECHANICAL ENGINEER RAYMOND, OH 116800 3 2026 Show Top H1B Job Titles
VEENUS INFOTECHS CORPORATION MECHANICAL ENGINEER RAYMOND, OH 116800 3 2026 Show Top H1B Job Titles
TOOGANN TECHNOLOGIES LLC CAE ENGINEER RAYMOND, OH 115000 2026 Show Top H1B Job Titles
AMERICAN HONDA MOTOR CO. INC Assistant Manager - Software & System Design Engineering RAYMOND, OH 115000 2026 Show Top H1B Job Titles
HONDA DEVELOPMENT & MANUFACTURING OF AMERICA LLC CAE Principal Engineer RAYMOND, OH 113000 2026 Show Top H1B Job Titles
TOOGANN TECHNOLOGIES LLC DESIGN ENGINEER RAYMOND, OH 99985.6015625 2026 Show Top H1B Job Titles
TOOGANN TECHNOLOGIES LLC DESIGN ENGINEER RAYMOND, OH 99985 2026 Show Top H1B Job Titles
HONDA DEVELOPMENT & MANUFACTURING OF AMERICA LLC Mechanical Design Sr. Engineer RAYMOND, OH 98000 2026 Show Top H1B Job Titles
TOOGANN TECHNOLOGIES LLC DESIGN ENGINEER RAYMOND, OH 98000 2026 Show Top H1B Job Titles
RACAR INTL D/E LLC SENIOR DESIGN ENGINEER RAYMOND, OH 97573 2026 Show Top H1B Job Titles
Pentangle Tech Services LLC MANUFACTURING ENGINEER RAYMOND, OH 95000 2026 Show Top H1B Job Titles
HONDA DEVELOPMENT & MANUFACTURING OF AMERICA LLC Equipment Design Sr. Engineer RAYMOND, OH 95000 2026 Show Top H1B Job Titles
WIPRO LIMITED Project Lead L1 RAYMOND, OH 94266 2026 Show Top H1B Job Titles
L&T TECHNOLOGY SERVICES LIMITED SOFTWARE DEVELOPER RAYMOND, OH 92124 2026 Show Top H1B Job Titles
L&T TECHNOLOGY SERVICES LIMITED INDUSTRIAL DESIGNER RAYMOND, OH 91000 2026 Show Top H1B Job Titles
TOOGANN TECHNOLOGIES LLC DESIGN ENGINEER RAYMOND, OH 90000 2026 Show Top H1B Job Titles
L&T TECHNOLOGY SERVICES LIMITED TEST VALIDATION ENGINEER RAYMOND, OH 85000 2026 Show Top H1B Job Titles
INDUS USA INC DESIGN ENGINEER RAYMOND, OH 83504 2026 Show Top H1B Job Titles
COMEDS GLOBAL LLC DESIGN ENGINEER RAYMOND, OH 83054 2026 Show Top H1B Job Titles
HONDA DEVELOPMENT & MANUFACTURING OF AMERICA LLC Sr. ADAS Test Engineer RAYMOND, OH 80000 2026 Show Top H1B Job Titles
L&T TECHNOLOGY SERVICES LIMITED INDUSTRIAL DESIGNER RAYMOND, OH 80000 2026 Show Top H1B Job Titles
INDUS USA INC DESIGN ENGINEER RAYMOND, OH 1030596 4 2025 Show Top H1B Job Titles
DELTA COMPUTER CONSULTING INC TECHNICAL LEAD RAYMOND, OH 233600 3 2025 Show Top H1B Job Titles
SOLIZE USA CORPORATION PROJECT DESIGN ENGINEER RAYMOND, OH 155490 3 2025 Show Top H1B Job Titles
HONDA DEVELOPMENT & MANUFACTURING OF AMERICA LLC Software & System Test Sr. Principal Engineer RAYMOND, OH 153459 2025 Show Top H1B Job Titles
L&T TECHNOLOGY SERVICES LIMITED TECHNICAL PROGRAM MANAGER RAYMOND, OH 145263 2025 Show Top H1B Job Titles
SOLIZE USA CORPORATION DESIGN RELEASE ENGINEER RAYMOND, OH 143080 3 2025 Show Top H1B Job Titles
SOLIZE USA CORPORATION PROJECT ENGINEER RAYMOND, OH 140160 3 2025 Show Top H1B Job Titles
SOLIZE USA CORPORATION PRODUCT ENGINEER RAYMOND, OH 137240 3 2025 Show Top H1B Job Titles
SOLIZE USA CORPORATION DESIGN RELEASE ENGINEER RAYMOND, OH 137240 3 2025 Show Top H1B Job Titles
SOLIZE USA CORPORATION DESIGN ENGINEER RAYMOND, OH 134320 3 2025 Show Top H1B Job Titles
PRECISION RESOURCES COMPANY INC DESIGN (AUTOMOTIVE) ENGINEER RAYMOND, OH 131400 3 2025 Show Top H1B Job Titles
VEENUS INFOTECHS CORPORATION MECHANICAL DESIGN ENGINEER RAYMOND, OH 127020 3 2025 Show Top H1B Job Titles
VEENUS INFOTECHS CORPORATION MECHANICAL DESIGN ENGINEER RAYMOND, OH 127020 3 2025 Show Top H1B Job Titles
VEENUS INFOTECHS CORPORATION MECHANICAL DESIGN ENGINEER RAYMOND, OH 127020 3 2025 Show Top H1B Job Titles
HONDA DEVELOPMENT & MANUFACTURING OF AMERICA LLC ADAS Design Principal Engineer RAYMOND, OH 125000 2025 Show Top H1B Job Titles
VEENUS INFOTECHS CORPORATION MECHANICAL DESIGN ENGINEER RAYMOND, OH 121180 3 2025 Show Top H1B Job Titles

Footnotes:

1 Salary was noted as Weekly in DOL records. We are displaying 52 times weekly salary in the salary field.

2 Salary was noted as Bi-Weekly in DOL records. We are displaying 26 times bi-weekly salary in the salary field.

3 Salary was noted as Hourly in DOL records. We are displaying 365x8 times hourly salary in the salary field.

4 Salary was noted as Monthly in DOL records. We are displaying 12 times Monthly salary in the salary field.

5 We weren't able to extract salary information correctly from the in DOL records. Showing it as is.

All other cases salary was mentioned as yearly in DOL records and displayed as is.

All the salaries from DOL records might not include all the bonuses / benefits and other things which are paid. Use these salaries as reference.