Top H1B Job Titles and Salary Range For ALLEGRO MICROSYSTEMS LLC , For 2015

Show Top H1B Job Titles and Salary Range For 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026
Job Title Total Number Of Records Minimum Salary Maximum Salary
SYSTEMS DESIGN ENGINEER 2 77646 77646
PRINCIPAL APPLICATIONS DEVELOPER (ORACLE) 2 108697.21875 108697.21875
PRODUCT DESIGN ENGINEER 1 61402 61402
PACKAGING ENGINEER 1 66976 66976
PACKAGING ENGINEERING DIRECTOR 1 180000 180000
PRINCIPAL DESIGN ENGINEER 1 105025.203125 105025.203125
SR. MICROELECTRONICS PACKAGING ASSEMBLY PROCESS EN 1 93787 93787
DESIGN ENGINEER 2 1 110000 110000
SR. MICROELECTRONICS PACKAGING ASSEMBLY PROCESS ENGINEER 1 93787 93787
DIGITAL VERIFICATION ENGINEER 1 75000 75000