H1B Salary Details For BOISE, ID

Total Records: 6259 - Showing maximum 50 Records per page

Records Per Page

H1B Salary Details For BOISE, ID has minimum salary 27000 and maximum salary 460151104 from 6259 records.

Employer Job Title City Salary Year
STACKIT PROFESSIONALS INC SOFTWARE ENGINEER BOISE, ID 98363 2019 Show Top H1B Job Titles
ERP ANALYSTS INC MICROSOFT DYNAMICS CRM DEVELOPER BOISE, ID 98363 2019 Show Top H1B Job Titles
HP INC IT DEVELOPER ENGINEER BOISE, ID 98363 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER CHEMICAL MECHANICAL PLANARIZATION (CMP) DRAM/EM BOISE, ID 98000 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER - RETICLE ENHANCEMENT TECHNOLOGY (RET) DESIGN BOISE, ID 98000 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC 3D X-POINT MEMORY CELL ENGINEER BOISE, ID 98000 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SUPPLY CHAIN PLANNER BOISE, ID 98000 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC R&D DRY ETCH PROCESS DEVELOPMENT ENGINEER BOISE, ID 98000 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC THIN FILM PROCESS DEVELOPMENT ENGINEER BOISE, ID 98000 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER - EMERGING MEMORY BOISE, ID 98000 2019 Show Top H1B Job Titles
IBM INDIA PRIVATE LIMITED SENIOR SAP HCM CONSULTANT BOISE, ID 97814 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER-CVD/DIFFUSION DRAM BOISE, ID 97760.2578125 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER-DRY ETCH-NVM BOISE, ID 97700 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC YIELD ENHANCEMENT NAND PHYSICAL FAILURE ANALYSIS ENGINEER BOISE, ID 97335 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC NAND DESIGN RULE ENGINEER BOISE, ID 97137 2019 Show Top H1B Job Titles
GLOBALFOUNDRIES U.S. INC MEMBER OF TECHNICAL STAFF (MTS) FACTORY AUTOMATION BOISE, ID 97053 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC NAND MEMORY CELL DEVICE ENGINEER BOISE, ID 97000 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER - PCVD METALS - DRAM/EM BOISE, ID 97000 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER-DRY ETCH-DRAM/EM BOISE, ID 97000 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER - CVD/DIFFUSION - DRAM/EM BOISE, ID 97000 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER-DRY ETCH-DRAM/EM BOISE, ID 97000 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC R&D DRY ETCH PROCESS DEVELOPMENT ENGINEER BOISE, ID 97000 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC MANAGER - FACTORY NETWORK LIAISON BOISE, ID 96969 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC IT DATA ENGINEER (BIG DATA ENGINEER) BOISE, ID 96958.15625 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC YE NAND/R&D ENGINEER BOISE, ID 96934.5 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER-PVD-NVM BOISE, ID 96900 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC PROCESS DEVELOPMENT ENGINEER - DRY ETCH BOISE, ID 96500 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER - DEVICE CHARACTERIZATION BOISE, ID 96500 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC NAND CELL RELIABILITY ENGINEER BOISE, ID 96500 2019 Show Top H1B Job Titles
MICRON SEMICONDUCTOR PRODUCTS INC NVM PRODUCT QUALITY & RELIABILITY ASSURANCE (PQRA) ENGINEER BOISE, ID 96500 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC GLOBAL QUALITY DATA ENGINEER BOISE, ID 96500 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ADVANCED MODELING ENGINEER BOISE, ID 96500 2019 Show Top H1B Job Titles
HEALTH PLAN OF NEVADA INC SOFTWARE ENGINEER (20012.2178) BOISE, ID 96242 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DATA SCIENTIST - TECHNOLOGY DEVELOPMENT BOISE, ID 96000 2019 Show Top H1B Job Titles
SYNAPSE TECH SERVICES LLC SOFTWARE QUALITY ENGINEER BOISE, ID 96000 2019 Show Top H1B Job Titles
APPLIED MATERIALS INC APPLICATION ENGINEER BOISE, ID 95950 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC NAND CELL WLR SOFTWARE DEVELOPMENT ENGINEER BOISE, ID 95445.21875 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC NAND CELL WLR SOFTWARE DEVELOPMENT ENGINEER BOISE, ID 95445.21875 2019 Show Top H1B Job Titles
APPLIED MATERIALS INC APPLIED CHEMIST (PROCESS ENGINEERING DEPT.) BOISE, ID 95400 2019 Show Top H1B Job Titles
LAM RESEARCH CORPORATION FIELD PROCESS ENGINEER BOISE, ID 95347 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DATA SCIENTIST - DEG PE BOISE, ID 95000 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC NAND PROCESS INTEGRATION ENGINEER BOISE, ID 95000 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER - DEVICE CHARACTERIZATION BOISE, ID 95000 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER - CELL BOISE, ID 95000 2019 Show Top H1B Job Titles
MICRON SEMICONDUCTOR PRODUCTS INC DATA SCIENTIST - DEG PE BOISE, ID 95000 2019 Show Top H1B Job Titles
DELL USA L.P SENIOR ADVISOR BUSINESS INTELLIGENCE BOISE, ID 95000 2019 Show Top H1B Job Titles
ERP ANALYSTS INC ABAP DEVELOPER BOISE, ID 95000 2019 Show Top H1B Job Titles
ERP ANALYSTS INC ABAP DEVELOPER BOISE, ID 95000 2019 Show Top H1B Job Titles
CLEARSLIDE INC SECURITY COMPLIANCE ANALYST BOISE, ID 95000 2019 Show Top H1B Job Titles
HERMES MICROVISION NORTH AMERICA SENIOR DESIGN ENGINEER 1/DESIGN ENGINEER 3 BOISE, ID 95000 2019 Show Top H1B Job Titles

Footnotes:

1 Salary was noted as Weekly in DOL records. We are displaying 52 times weekly salary in the salary field.

2 Salary was noted as Bi-Weekly in DOL records. We are displaying 26 times bi-weekly salary in the salary field.

3 Salary was noted as Hourly in DOL records. We are displaying 365x8 times hourly salary in the salary field.

4 Salary was noted as Monthly in DOL records. We are displaying 12 times Monthly salary in the salary field.

5 We weren't able to extract salary information correctly from the in DOL records. Showing it as is.

All other cases salary was mentioned as yearly in DOL records and displayed as is.

All the salaries from DOL records might not include all the bonuses / benefits and other things which are paid. Use these salaries as reference.