H1B Salary Details For BOISE, ID

Total Records: 6259 - Showing maximum 50 Records per page

Records Per Page

H1B Salary Details For BOISE, ID has minimum salary 27000 and maximum salary 460151104 from 6259 records.

Employer Job Title City Salary Year
OPTIV SECURITY INC SENIOR CONSULTANT I BOISE, ID 104000 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER-PCVD METALS-DRAM/EM BOISE, ID 104000 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC INFORMATION ARCHITECT BOISE, ID 104000 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC INFORMATION ARCHITECT BOISE, ID 104000 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER BOISE, ID 103500 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC THIN FILMS PROCESS DEVELOPMENT ENGINEER BOISE, ID 103500 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC THIN FILMS PROCESS DEVELOPMENT ENGINEER BOISE, ID 103500 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Emerging Memory Process Integration Engineer BOISE, ID 103500 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Emerging Memory Process Integration Engineer BOISE, ID 103500 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC THIN FILMS PROCESS DEVELOPMENT ENGINEER BOISE, ID 103500 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC THIN FILMS PROCESS DEVELOPMENT ENGINEER BOISE, ID 103500 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER BOISE, ID 103500 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Engineer-Chemical Mechanical Planarization (CMP)-DRAM/EM BOISE, ID 103494.8203125 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Engineer-Chemical Mechanical Planarization (CMP)-DRAM/EM BOISE, ID 103494.8203125 2021 Show Top H1B Job Titles
LAM RESEARCH CORPORATION FIELD PROCESS ENGINEER BOISE, ID 103000 2021 Show Top H1B Job Titles
KLA CORPORATION FIELD APPLICATIONS ENGINEER BOISE, ID 102889 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Sr. Eng.-MDE Chemical Mechanical Planarization (CMP) Process BOISE, ID 102619.921875 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Sr. Eng.-MDE Chemical Mechanical Planarization (CMP) Process BOISE, ID 102619.921875 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Engineer-PCS Lead BOISE, ID 102500.0625 2021 Show Top H1B Job Titles
BOISE STATE UNIVERSITY ASSISTANT PROFESSOR OF GEOPHYSICS BOISE, ID 102268.44140625 4 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC R&D DRY ETCH PROCESS DEVELOPMENT ENGINEER BOISE, ID 102259.296875 2021 Show Top H1B Job Titles
ASTA CRS INC SYSTEM ADMINISTRATOR BOISE, ID 102200 3 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC NAND PROCESS INTEGRATION ENGINEER BOISE, ID 102000.078125 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC R&D DRY ETCH PROCESS DEVELOPMENT ENGINEER BOISE, ID 102000.078125 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC R&D DRY ETCH PROCESS DEVELOPMENT ENGINEER BOISE, ID 102000.078125 2021 Show Top H1B Job Titles
HP INC Data Engineer (Systems/Software Engineer) BOISE, ID 102000 2021 Show Top H1B Job Titles
HP INC Data Engineer (Systems/Software Engineer) BOISE, ID 102000 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SENIOR REVENUE ACCOUNTANT BOISE, ID 102000 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SENIOR REVENUE ACCOUNTANT BOISE, ID 102000 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SENIOR REVENUE ACCOUNTANT BOISE, ID 102000 2021 Show Top H1B Job Titles
HP INC Data Engineer (Systems/Software Engineer) BOISE, ID 102000 2021 Show Top H1B Job Titles
BOISE STATE UNIVERSITY ASSISTANT PROFESSOR OF COMPUTER SCIENCE BOISE, ID 101816 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Emerging Memory Process Integration Engineer BOISE, ID 101661.0390625 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Emerging Memory Process Integration Engineer BOISE, ID 101661.0390625 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC PRODUCT ENGINEER BOISE, ID 101493.078125 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DATA SCIENTIST BOISE, ID 101000 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DATA SCIENTIST BOISE, ID 101000 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC IT SALESFORCE ENGINEER BOISE, ID 100700 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Industrial Engineer - Project Manager BOISE, ID 100686 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Industrial Engineer - Project Manager BOISE, ID 100686 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SENIOR PROCESS INTEGRATION ENGINEER BOISE, ID 100500 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SENIOR PROCESS INTEGRATION ENGINEER BOISE, ID 100500 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Strategic Product Planning Analyst BOISE, ID 100450.21875 2021 Show Top H1B Job Titles
HP INC IT DEVELOPER/ENGINEER BOISE, ID 100432.2578125 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Sr. Engineer-Dry Etch-Nvm BOISE, ID 100404.203125 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC NAND CELL ENGINEER BOISE, ID 100000 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SR PROGRAM MANAGER PMO BOISE, ID 100000 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC R&D DRY ETCH PROCESS DEVELOPMENT ENGINEER BOISE, ID 100000 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC 3DxP Cell Device and Array Characterization Engineer BOISE, ID 100000 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SR PROGRAM MANAGER PMO BOISE, ID 100000 2021 Show Top H1B Job Titles

Footnotes:

1 Salary was noted as Weekly in DOL records. We are displaying 52 times weekly salary in the salary field.

2 Salary was noted as Bi-Weekly in DOL records. We are displaying 26 times bi-weekly salary in the salary field.

3 Salary was noted as Hourly in DOL records. We are displaying 365x8 times hourly salary in the salary field.

4 Salary was noted as Monthly in DOL records. We are displaying 12 times Monthly salary in the salary field.

5 We weren't able to extract salary information correctly from the in DOL records. Showing it as is.

All other cases salary was mentioned as yearly in DOL records and displayed as is.

All the salaries from DOL records might not include all the bonuses / benefits and other things which are paid. Use these salaries as reference.