Top H1B Job Titles and Salary Range For Winbond Electronics Corporation America , For 2015
Job Title | Total Number Of Records | Minimum Salary | Maximum Salary |
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H1B Salary Data For Companies
MASSACHUSETTS INSTITUTE OF TECHNOLOGY (MIT)
RHEA TECHNOLOGIES INC
PAC-12 CONFERENCE
TARISIO AUCTIONS LLC
ASTROSOFT TERCHNOLOGIES LLC
B.Y. INTERNATIONAL INC
MODUS STUDIO PLLC
RENNER OTTO BOISSELLE & SKLAR LLP
OCEANIA TOURS
BENTLEY ARCHITECTS AND ENGINEERS INC
CHECKPOINT SYSTEMS INC
PROOF ADVERTISING LLC
INVENTORY LOCATOR SERVICE
Collective Management Services Inc
Trajektory LLC
TLP Management Services LLC
EvolOH Inc
Excidion Inc
Alchemer LLC
The Algae Foundation
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H1B Salary Data for Job Titles
SOFTWARE ENGINEER 1615.31840
FINANCIAL PLANNING & ANALYSIS
VICE PRESIDENT MODEL STRATEGY AND IMPLEMENTATION
HARDWARE ENGINEER 1615.32350.6
DEVELOPMENT AND OPERATIONS ENGINEER SENIOR
Associate Product Control Analyst
Digital Engineering Accessibility Dev
Data Analyst (20012.4663.1)
Senior Mechanical Propulsion Engineer
Director Cloud Platform Security