Total Records: 1 - Showing maximum 50 Records per page
H1B Salary Details For Principal Engineer Packaging
H1B Salary Details For Principal Engineer Packaging has minimum salary 169341.328125 and maximum salary 169341.328125 from 1 records.
Employer | Job Title | City | Salary | Year | |
---|---|---|---|---|---|
RENESAS ELECTRONICS AMERICA INC | Principal Engineer Packaging | SAN JOSE, CA | 169341.328125 | 2021 | Show Top H1B Job Titles |
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Footnotes:
1 Salary was noted as Weekly in DOL records. We are displaying 52 times weekly salary in the salary field.
2 Salary was noted as Bi-Weekly in DOL records. We are displaying 26 times bi-weekly salary in the salary field.
3 Salary was noted as Hourly in DOL records. We are displaying 365x8 times hourly salary in the salary field.
4 Salary was noted as Monthly in DOL records. We are displaying 12 times Monthly salary in the salary field.
5 We weren't able to extract salary information correctly from the in DOL records. Showing it as is.
All other cases salary was mentioned as yearly in DOL records and displayed as is.
All the salaries from DOL records might not include all the bonuses / benefits and other things which are paid. Use these salaries as reference.