Total Records: 23 - Showing maximum 50 Records per page

H1B Salary Details For Engineer III Software Analysis Engineering

Records Per Page

H1B Salary Details For Engineer III Software Analysis Engineering has minimum salary 115000 and maximum salary 155000 from 23 records.

Employer Job Title City Salary Year
SAMSUNG ELECTRONICS AMERICA INC Engineer III Software Analysis Engineering PLANO, TX 155000 2023 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC Engineer III Software Analysis Engineering PLANO, TX 155000 2023 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC Engineer III Software Analysis Engineering PLANO, TX 155000 2023 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC Engineer III Software Analysis Engineering BURTONSVILLE, MD 155000 2023 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC Engineer III Software Analysis Engineering BURTONSVILLE, MD 155000 2023 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC Engineer III Software Analysis Engineering PLANO, TX 150000 2023 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC Engineer III Software Analysis Engineering PLANO, TX 150000 2023 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC Engineer III Software Analysis Engineering PLANO, TX 130000 2022 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC Engineer III Software Analysis Engineering PLANO, TX 130000 2022 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC Engineer III Software Analysis Engineering PLANO, TX 130000 2022 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC Engineer III Software Analysis Engineering PLANO, TX 142000 2021 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC Engineer III Software Analysis Engineering PLANO, TX 142000 2021 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC Engineer III Software Analysis Engineering PLANO, TX 142000 2021 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC Engineer III Software Analysis Engineering PLANO, TX 142000 2021 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC Engineer III Software Analysis Engineering PLANO, TX 142000 2021 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC Engineer III Software Analysis Engineering PLANO, TX 130000 2021 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC Engineer III Software Analysis Engineering PLANO, TX 130000 2021 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC Engineer III Software Analysis Engineering REDMOND, WA 135000 2020 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC Engineer III Software Analysis Engineering PLANO, TX 130000 2020 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC Engineer III Software Analysis Engineering PLANO, TX 130000 2020 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC Engineer III Software Analysis Engineering PLANO, TX 130000 2020 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC Engineer III Software Analysis Engineering PLANO, TX 130000 2020 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC Engineer III Software Analysis Engineering PLANO, TX 115000 2020 Show Top H1B Job Titles

Footnotes:

1 Salary was noted as Weekly in DOL records. We are displaying 52 times weekly salary in the salary field.

2 Salary was noted as Bi-Weekly in DOL records. We are displaying 26 times bi-weekly salary in the salary field.

3 Salary was noted as Hourly in DOL records. We are displaying 365x8 times hourly salary in the salary field.

4 Salary was noted as Monthly in DOL records. We are displaying 12 times Monthly salary in the salary field.

5 We weren't able to extract salary information correctly from the in DOL records. Showing it as is.

All other cases salary was mentioned as yearly in DOL records and displayed as is.

All the salaries from DOL records might not include all the bonuses / benefits and other things which are paid. Use these salaries as reference.