Total Records: 20 - Showing maximum 50 Records per page

H1B Salary Details For ENGINEER III SOFTWARE PROCESS ENGINEERING

Records Per Page

H1B Salary Details For ENGINEER III SOFTWARE PROCESS ENGINEERING has minimum salary 130000 and maximum salary 193000 from 20 records.

Employer Job Title City Salary Year
SAMSUNG ELECTRONICS AMERICA INC ENGINEER III SOFTWARE PROCESS ENGINEERING MOUNTAIN VIEW, CA 179000 2024 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER III SOFTWARE PROCESS ENGINEERING MOUNTAIN VIEW, CA 179000 2024 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER III SOFTWARE PROCESS ENGINEERING MOUNTAIN VIEW, CA 193000 2023 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER III SOFTWARE PROCESS ENGINEERING MOUNTAIN VIEW, CA 193000 2023 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER III SOFTWARE PROCESS ENGINEERING MOUNTAIN VIEW, CA 193000 2023 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER III SOFTWARE PROCESS ENGINEERING MOUNTAIN VIEW, CA 167149 2023 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER III SOFTWARE PROCESS ENGINEERING MOUNTAIN VIEW, CA 167149 2023 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER III SOFTWARE PROCESS ENGINEERING MOUNTAIN VIEW, CA 167149 2023 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER III SOFTWARE PROCESS ENGINEERING BELLEVUE, WA 148013 2023 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER III SOFTWARE PROCESS ENGINEERING PLANO, TX 139464 2023 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER III SOFTWARE PROCESS ENGINEERING MOUNTAIN VIEW, CA 160000 2022 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER III SOFTWARE PROCESS ENGINEERING MOUNTAIN VIEW, CA 141378 2022 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER III SOFTWARE PROCESS ENGINEERING BELLEVUE, WA 156000 2021 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER III SOFTWARE PROCESS ENGINEERING BELLEVUE, WA 156000 2021 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER III SOFTWARE PROCESS ENGINEERING PLANO, TX 130000 2021 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER III SOFTWARE PROCESS ENGINEERING MOUNTAIN VIEW, CA 175000 2020 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER III SOFTWARE PROCESS ENGINEERING MOUNTAIN VIEW, CA 160000 2020 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER III SOFTWARE PROCESS ENGINEERING MOUNTAIN VIEW, CA 170000 2018 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER III SOFTWARE PROCESS ENGINEERING MOUNTAIN VIEW, CA 165000 2018 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER III SOFTWARE PROCESS ENGINEERING BELLEVUE, WA 150000 2018 Show Top H1B Job Titles

Footnotes:

1 Salary was noted as Weekly in DOL records. We are displaying 52 times weekly salary in the salary field.

2 Salary was noted as Bi-Weekly in DOL records. We are displaying 26 times bi-weekly salary in the salary field.

3 Salary was noted as Hourly in DOL records. We are displaying 365x8 times hourly salary in the salary field.

4 Salary was noted as Monthly in DOL records. We are displaying 12 times Monthly salary in the salary field.

5 We weren't able to extract salary information correctly from the in DOL records. Showing it as is.

All other cases salary was mentioned as yearly in DOL records and displayed as is.

All the salaries from DOL records might not include all the bonuses / benefits and other things which are paid. Use these salaries as reference.