Total Records: 17 - Showing maximum 50 Records per page

H1B Salary Details For ENGINEER II SOFTWARE PROCESS ENGINEERING

Records Per Page

H1B Salary Details For ENGINEER II SOFTWARE PROCESS ENGINEERING has minimum salary 110000 and maximum salary 165000 from 17 records.

Employer Job Title City Salary Year
SAMSUNG ELECTRONICS AMERICA INC ENGINEER II SOFTWARE PROCESS ENGINEERING MOUNTAIN VIEW, CA 150000 2023 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER II SOFTWARE PROCESS ENGINEERING MOUNTAIN VIEW, CA 150000 2023 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER II SOFTWARE PROCESS ENGINEERING MOUNTAIN VIEW, CA 150000 2023 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER II SOFTWARE PROCESS ENGINEERING BELLEVUE, WA 148013 2023 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER II SOFTWARE PROCESS ENGINEERING BELLEVUE, WA 148013 2023 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER II SOFTWARE PROCESS ENGINEERING BELLEVUE, WA 148013 2023 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER II SOFTWARE PROCESS ENGINEERING MOUNTAIN VIEW, CA 125000 2023 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER II SOFTWARE PROCESS ENGINEERING BELLEVUE, WA 148013 2022 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER II SOFTWARE PROCESS ENGINEERING PLANO, TX 115000 2021 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER II SOFTWARE PROCESS ENGINEERING MOUNTAIN VIEW, CA 165000 2020 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER II SOFTWARE PROCESS ENGINEERING BELLEVUE, WA 140000 2020 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER II SOFTWARE PROCESS ENGINEERING BELLEVUE, WA 139650 2020 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER II SOFTWARE PROCESS ENGINEERING MOUNTAIN VIEW, CA 140000 2019 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER II SOFTWARE PROCESS ENGINEERING MOUNTAIN VIEW, CA 140000 2019 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER II SOFTWARE PROCESS ENGINEERING BELLEVUE, WA 120000 2019 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER II SOFTWARE PROCESS ENGINEERING PLANO, TX 110000 2019 Show Top H1B Job Titles
SAMSUNG ELECTRONICS AMERICA INC ENGINEER II SOFTWARE PROCESS ENGINEERING RICHARDSON, TX 132000 2018 Show Top H1B Job Titles

Footnotes:

1 Salary was noted as Weekly in DOL records. We are displaying 52 times weekly salary in the salary field.

2 Salary was noted as Bi-Weekly in DOL records. We are displaying 26 times bi-weekly salary in the salary field.

3 Salary was noted as Hourly in DOL records. We are displaying 365x8 times hourly salary in the salary field.

4 Salary was noted as Monthly in DOL records. We are displaying 12 times Monthly salary in the salary field.

5 We weren't able to extract salary information correctly from the in DOL records. Showing it as is.

All other cases salary was mentioned as yearly in DOL records and displayed as is.

All the salaries from DOL records might not include all the bonuses / benefits and other things which are paid. Use these salaries as reference.