Total Records: 27 - Showing maximum 50 Records per page

H1B Salary Details For DRAM PRODUCT ENGINEER

Records Per Page

H1B Salary Details For DRAM PRODUCT ENGINEER has minimum salary 70000 and maximum salary 130286 from 27 records.

Employer Job Title City Salary Year
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER BOISE, ID 90000 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER BOISE, ID 92000 2022 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER BOISE, ID 84000 2022 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER LEHI, UT 130286 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER BOISE, ID 87143 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER BOISE, ID 87143 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER LEHI, UT 130286 2020 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER MANASSAS, VA 98000 2020 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER BOISE, ID 84746 2020 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER BOISE, ID 74000 2020 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER BOISE, ID 82000 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER BOISE, ID 80000 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER BOISE, ID 92400.1015625 2017 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER BOISE, ID 86346 2017 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER BOISE, ID 83950 2017 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER BOISE, ID 78000 2017 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER BOISE, ID 73440 2017 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER BOISE, ID 90000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER BOISE, ID 86000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER BOISE, ID 82000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER BOISE, ID 70000 2015 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER BOISE, ID 75000.1171875 2014 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER BOISE, ID 75000.1171875 2014 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER BOISE, ID 75000.1171875 2014 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER BOISE, ID 75000.1171875 2014 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER BOISE, ID 75000 2014 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PRODUCT ENGINEER BOISE, ID 75000 2014 Show Top H1B Job Titles

Footnotes:

1 Salary was noted as Weekly in DOL records. We are displaying 52 times weekly salary in the salary field.

2 Salary was noted as Bi-Weekly in DOL records. We are displaying 26 times bi-weekly salary in the salary field.

3 Salary was noted as Hourly in DOL records. We are displaying 365x8 times hourly salary in the salary field.

4 Salary was noted as Monthly in DOL records. We are displaying 12 times Monthly salary in the salary field.

5 We weren't able to extract salary information correctly from the in DOL records. Showing it as is.

All other cases salary was mentioned as yearly in DOL records and displayed as is.

All the salaries from DOL records might not include all the bonuses / benefits and other things which are paid. Use these salaries as reference.