Total Records: 25 - Showing maximum 50 Records per page

H1B Salary Details For DRAM DESIGN ENGINEER

Records Per Page

H1B Salary Details For DRAM DESIGN ENGINEER has minimum salary 88000 and maximum salary 128000.078125 from 25 records.

Employer Job Title City Salary Year
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER ATLANTA, GA 105500 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER BOISE, ID 100740.34375 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER BOISE, ID 94710 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER BOISE, ID 94710 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER BOISE, ID 120000 2022 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER ALLEN, TX 103000 2022 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER BOISE, ID 103500 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER BOISE, ID 103500 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER ALLEN, TX 103000 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER ALLEN, TX 103000 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER BOISE, ID 92000 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER BOISE, ID 92000 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER BOISE, ID 88065 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER BOISE, ID 88065 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER BOISE, ID 88000 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER BOISE, ID 88000 2021 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER BOISE, ID 103500 2020 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER BOISE, ID 92400 2020 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER BOISE, ID 88065 2020 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER BOISE, ID 88000 2020 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER BOISE, ID 88000 2020 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER BOISE, ID 88000 2020 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER BOISE, ID 128000.078125 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER BOISE, ID 110000 2019 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM DESIGN ENGINEER BOISE, ID 90000 2019 Show Top H1B Job Titles

Footnotes:

1 Salary was noted as Weekly in DOL records. We are displaying 52 times weekly salary in the salary field.

2 Salary was noted as Bi-Weekly in DOL records. We are displaying 26 times bi-weekly salary in the salary field.

3 Salary was noted as Hourly in DOL records. We are displaying 365x8 times hourly salary in the salary field.

4 Salary was noted as Monthly in DOL records. We are displaying 12 times Monthly salary in the salary field.

5 We weren't able to extract salary information correctly from the in DOL records. Showing it as is.

All other cases salary was mentioned as yearly in DOL records and displayed as is.

All the salaries from DOL records might not include all the bonuses / benefits and other things which are paid. Use these salaries as reference.