Top H1B Job Titles and Salary Range For TOKYO ELECTRON AMERICA INC , From 2014 - To 2026

Show Top H1B Job Titles and Salary Range For 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026
Job Title Total Number Of Records Minimum Salary Maximum Salary
TECHNICAL SUPPORT SPECIALIST III 11 90677 151080.515625
RESEARCH SCIENTIST III 8 108000.1015625 125582.6015625
TECHNICAL SUPPORT SPECIALIST II 7 78600 100240
PROCESS ENGINEER 6 82000 97904.609375
PROCESS ENGINEER II 3 72000 75005
SOFTWARE DEVELOPMENT ENGINEER II 3 80000.1796875 81060.9765625
PROCESS ENGINEER III 3 78156.78125 115000.078125
PRODUCT APPLICATIONS ENGINEER SR. 3 135000.0625 139490.265625
BUSINESS INTELLIGENCE ANALYST 3 103000 106501.9765625
SENIOR DATA ENGINEER 3 139999 139999
SR. PRODUCT APPLICATIONS ENGINEER 2 142559.046875 142559.046875
FIELD APPLICATION ENGINEER SENIOR 2 92772.9375 92772.9375
PRODUCT SALES SPECIALIST I 2 116470.9375 116470.9375
FIELD SERVICE/START-UP ENGINEER IV 2 76481.6015625 76481.6015625
SR. PRODUCT MARKETING ENGINEER 2 130000 130000
Engineer Process III 2 105000.21875 105000.21875
Job Field Service/Start-Up Engineer II 2 62400 62400
Research Scientist III CA 2 120000.140625 120000.140625
FIELD APPLICATIONS ENGINEER II 2 65000 77455
FIELD APPLICATION ENGINEER III 2 126874 126874
Engineer Data III 1 135554 135554
DATA ENGINEER 1 115000 115000
RESEARCH SCIENTIST 1 108000.1015625 108000.1015625
TECHNICAL SUPPORT SPECIALIST 1 125300 125300
MANAGER PROCESS ENGINEERING 1 131338.484375 131338.484375
PROCESS ENGINEER SENIOR 1 116480 116480
FIELD APPLICATIONS ENGINEER 1 104365.5 104365.5
SR MGR PRODUCT ENGINEERING 1 155000 155000
Director Process Integration 1 170676.21875 170676.21875
Data Informatic Analyst 1 115000.078125 115000.078125
Data Informatics Analyst Senior 1 140000.125 140000.125
Engineer Process Senior 1 122244.9765625 122244.9765625
Senior Director of Business Solutions and Development 1 260000 260000
Data Informatic Analyst Senior 1 147098.640625 147098.640625
SOFTWARE ENGINEER 1 137500 137500