Top H1B Job Titles and Salary Range For SITIME CORPORATION , From 2014 - To 2026

Show Top H1B Job Titles and Salary Range For 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026
Job Title Total Number Of Records Minimum Salary Maximum Salary
SYSTEMS ENGINEER II 12 118000 146000
MEMS DEVELOPMENT ENGINEER 8 100000 150000
SR. CAD ENGINEER 5 133910 180000
CMOS ANALOG DESIGN ENGINEER 5 83824 105394
SYSTEMS ENGINEER 4 105000 120000
SYSTEMS CHARACTERIZATION ENGINEER 4 100000 110000
SYSTEMS CHARACTERIZATION ENGINEER II 3 94619 115000
SENIOR CMOS ANALOG MIXED-SIGNAL DESIGN ENGINEER 3 131955 131955
Director Circuit Design Engineering 3 230000 230000
SENIOR TEST ENGINEER 2 133910 185000
Manager Test Eningeering 2 190000 190000
Principal MEMS Development Engineer 2 170000 180000
Lead Systems Engineering 2 140000 140000
MANAGER SYSTEMS ENGINEERING 2 152901 152901
TEST ENGINEER 2 120000 140000
Director Foundry Relations 2 180000 180000
COMPUTATIONAL SCIENTIST 2 90000 90000
MEMS SYSTEMS ENGINEER 2 105394 105394
Senior MEMS Development Engineer 1 150000 150000
Manager MEMS Engineering 1 157539 157539
NETWORK SECURITY ENGINEER 1 152000 152000
SENIOR SYSTEMS CHARACTERIZATION ENGINEER 1 126000 126000
SOFTWARE SYSTEMS ENGINEER 1 95000 95000
SR. SOFTWARE ENGINEER 1 145000 145000
SENIOR TECHNICAL PROGRAM MANAGER 1 200200 200200
MEMS SYSTEMS ENGINEER II 1 108805 108805
SR. TEST ENGINEER 1 106517 106517
SENIOR MEMS SYSTEMS ENGINEER 1 115253 115253
SYSTEMS ENGINEER - INFRASTRUCTURE DEVELOPMENT 1 115000 115000
PRINCIPAL ANALOG MIXED SIGNAL DESIGN ENGINEER 1 131955 131955
CMOS ANALOG MIXED-SIGNAL DESIGN ENGINEER II 1 128232 128232
PRINCIPAL DATA ENGINEER 1 191000 191000
Systems Characterization Lead Engineer 1 118000 118000
SR. SYSTEMS ENGINEER 1 155000 155000
ASSOCIATE MEMS DEVELOPMENT ENGINEER 1 111000 111000
SENIOR PRINCIPAL ANALOG MIXED SIGNAL DESIGN ENGINEER 1 147950 147950
Package Design Engineer 1 115000 115000
TECHNICAL PROGRAM MANAGER 1 182000 182000
SR. ANALOG MIXED-SIGNAL CIRCUIT DESIGN ENGINEER 1 152526 152526