Top H1B Job Titles and Salary Range For SILICONWARE USA INC , From 2014 - To 2026

Show Top H1B Job Titles and Salary Range For 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026
Job Title Total Number Of Records Minimum Salary Maximum Salary
MATERIAL ENGINEER 2 64584 91875
MATERIALS ENGINEER 1 74485 74485
SUBSTRATE DESIGN ENGINEER (IC PACKAGING) 1 122727.59375 122727.59375
DIRECTOR OF TEST TECHNICAL PROGRAM MANAGEMENT 1 115000 115000