H1B Salary Details For BOISE, ID

Total Records: 6259 - Showing maximum 50 Records per page

Records Per Page

H1B Salary Details For BOISE, ID has minimum salary 27000 and maximum salary 460151104 from 6259 records.

Employer Job Title City Salary Year
MICRON TECHNOLOGY INC TPCE-PROBE KEG PROCESS ENG LEAD BOISE, ID 96488 2016 Show Top H1B Job Titles
MICROSOFT CORPORATION SUPPORT ESCALATION ENGINEER BOISE, ID 96050 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC MANAGER-DRAM CAPACITOR PROCESS INTEGRATION BOISE, ID 95939.796875 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER-PCVDI PROCESS BOISE, ID 95921 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC WET PROCESS MANUFACTURING DEVELOPMENT ENGINEER BOISE, ID 95700 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC PHOTO PROCESS DEVELOPMENT ENGINEER BOISE, ID 95200 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC R&D PHOTOLITHOGRAPHY ENGINEER BOISE, ID 95000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC PQRA SENIOR NAND RMA ENGINEER BOISE, ID 95000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRAM PROCESS INTEGRATION ENGINEER BOISE, ID 95000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC R&D PHOTOLITHOGRAPHY ENGINEER BOISE, ID 95000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC R&D PHOTOLITHOGRAPHY ENGINEER BOISE, ID 95000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER-PCVD METALS - DRAM/EM BOISE, ID 95000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC R&D THIN FILMS PROCESS DEVELOPMENT ENGINEER BOISE, ID 95000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SCIENTIFIC ENGINEER - CMP PROCESS BOISE, ID 95000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC CELL ENGINEER BOISE, ID 95000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC PROCESS ENGINEER BOISE, ID 95000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC NVE PRODUCT ENGINEER BOISE, ID 95000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER-PHOTO PROCESS BOISE, ID 94972 2016 Show Top H1B Job Titles
BODYBUILDING.COM LLC SENIOR JAVA SOFTWARE ENGINEER BOISE, ID 94863 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SAP BASIS ADMINISTRATOR BOISE, ID 94500 2016 Show Top H1B Job Titles
HERMES MICROVISION INC APPLICATION ENGINEER BOISE, ID 94302.6484375 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC R&D EMERGING MEMORY ARRAY DEVELOPMENT ENGINEER BOISE, ID 94000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER-PROCESS INTEGRATION/R&D BOISE, ID 94000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC WET PROCESS DEVELOPMENT ENGINEER BOISE, ID 94000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER - DRY ETCH DRAM/EM BOISE, ID 93800 2016 Show Top H1B Job Titles
EXPERIS US INC SENIOR SYSTEMS ANALYST BOISE, ID 93615.203125 3 2016 Show Top H1B Job Titles
EXPERIS US INC SENIOR PROGRAMMER ANALYST BOISE, ID 93615.203125 3 2016 Show Top H1B Job Titles
BODYBUILDING.COM LLC SOFTWARE ENGINEER - TEAM LEAD BOISE, ID 93500 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC RELIABILITY MODELING ENGINEER BOISE, ID 93080 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER-PCVD METALS DRAM/EM BOISE, ID 93080 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER - PCVD METALS DRAM/EM BOISE, ID 93080 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER-TECH DEV-NVM BOISE, ID 93080 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER- DIFFUSION DRAM/EM BOISE, ID 93080 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC THIN FILM PROCESS DEVELOPMENT ENGINEER BOISE, ID 93000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC CMP PROCESS DEVELOPMENT ENGINEER BOISE, ID 93000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC CVD METALS PROCESS ENGINEER BOISE, ID 93000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER - DRY ETCH DRAM/EM BOISE, ID 93000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER - METROLOGY APPLICATIONS - DRAM/R&D BOISE, ID 93000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC NON-VOLATILE PRODUCT ENGINEER BOISE, ID 93000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC PACKAGE SIMULATION ENGINEER BOISE, ID 93000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER-WET PROCESS DRAM/EM/R&D BOISE, ID 93000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC R&D THIN FILMS PROCESS DEVELOPMENT ENGINEER BOISE, ID 92700 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER- NAND CELL BOISE, ID 92700 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DRY ETCH PROCESS DEVELOPMENT ENGINEER BOISE, ID 92000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER-NAND CELL BOISE, ID 92000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC NAND ENGINEER BOISE, ID 92000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER - CMP - NVM/R&D BOISE, ID 92000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER-NAND CELL BOISE, ID 92000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER-CMP-DRAM/EM BOISE, ID 92000 2016 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER-CMP-NVM/R&D BOISE, ID 92000 2016 Show Top H1B Job Titles

Footnotes:

1 Salary was noted as Weekly in DOL records. We are displaying 52 times weekly salary in the salary field.

2 Salary was noted as Bi-Weekly in DOL records. We are displaying 26 times bi-weekly salary in the salary field.

3 Salary was noted as Hourly in DOL records. We are displaying 365x8 times hourly salary in the salary field.

4 Salary was noted as Monthly in DOL records. We are displaying 12 times Monthly salary in the salary field.

5 We weren't able to extract salary information correctly from the in DOL records. Showing it as is.

All other cases salary was mentioned as yearly in DOL records and displayed as is.

All the salaries from DOL records might not include all the bonuses / benefits and other things which are paid. Use these salaries as reference.