H1B Salary Details For BOISE, ID

Total Records: 6259 - Showing maximum 50 Records per page

Records Per Page

H1B Salary Details For BOISE, ID has minimum salary 27000 and maximum salary 460151104 from 6259 records.

Employer Job Title City Salary Year
MICRON TECHNOLOGY INC Tester Applications Engineer BOISE, ID 145000 2025 Show Top H1B Job Titles
Micron Idaho Semiconductor Manufacturing (Triton) LLC Senior Semiconductor Process Engineer BOISE, ID 144999 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Sr IT Solution Architect - OP BOISE, ID 144625.71875 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC IT Manager Application Services BOISE, ID 144126 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Senior Engineer-CVD/DIFF-DRAM/EM BOISE, ID 141861 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SOFTWARE DEVELOPMENT ENGINEER BOISE, ID 141693 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SENIOR PROCESS ENGINEER BOISE, ID 141075 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Manager Strategic Product Planning BOISE, ID 141000 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Sr Layout Engineer BOISE, ID 140004 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Sr. Semiconductor Process Engineer BOISE, ID 140000 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SENIOR BUSINESS INTELLIGENCE ANALYST BOISE, ID 140000 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Global Facilities Engineer - Chemical BOISE, ID 137500 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC APPLICATIONS ENGINEER BOISE, ID 136000 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC IT FinOps Business Analyst BOISE, ID 136000 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Sr. Engineer - NAND PI BOISE, ID 135742 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC MANAGER SUPPLY CHAIN ENGINEERING BOISE, ID 135713.59375 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Sr Engineer - Data Storage and Resilience BOISE, ID 135188 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ADVANCED MODELING ENGINEER BOISE, ID 135000 2025 Show Top H1B Job Titles
SCHWEITZER ENGINEERING LABORATORIES INC DEVELOPMENT LEAD ENGINEER BOISE, ID 135000 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Senior Semiconductor Process Engineer BOISE, ID 135000 2025 Show Top H1B Job Titles
ERP ANALYSTS INC SOFTWARE ENGINEER BOISE, ID 135000 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SR. PMO PROGRAM MANAGER BOISE, ID 134844.234375 2025 Show Top H1B Job Titles
J.R. SIMPLOT COMPANY Business Intelligence Data Engineer III BOISE, ID 134139 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC NPI Operations Product Manager BOISE, ID 133990 2025 Show Top H1B Job Titles
APPLIED MATERIALS INC Manager Process Support Engineer BOISE, ID 133430 2025 Show Top H1B Job Titles
EXYTE U.S. INC Lead Pipe Stress Engineer BOISE, ID 133000 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SENIOR PRODUCT LINE MANAGER BOISE, ID 132965.015625 2025 Show Top H1B Job Titles
THE INTERNET TRUCKSTOP LLC SOFTWARE ENGINEER III BOISE, ID 132000 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SR. DESIGN ENG DRAM TECHNOLOGY NODE DEV BOISE, ID 131964 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC NAND Product Reliability Engineer BOISE, ID 131861 2025 Show Top H1B Job Titles
AMAZON DATA SERVICES INC TECHNICAL OPERATIONS ENGINEER I BOISE, ID 131000 2025 Show Top H1B Job Titles
COGNIZANT TECHNOLOGY SOLUTIONS US CORP Manager JC50 - Computer Systems Engineers/Architects BOISE, ID 130208 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SENIOR SOFTWARE ENGINEER BOISE, ID 130077.3828125 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SENIOR PCB DESIGNER BOISE, ID 130000 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Senior DRAM Yield & Quality Product Engineer BOISE, ID 129980 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Sr. IT Engineer - Mobile Device Management BOISE, ID 129334 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Staff OM Operations Analyst BOISE, ID 128838.9609375 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC IT Solution Architect - PLM BOISE, ID 127963 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC PRINCIPAL ENGINEER - NVE MANAGED NAND PE BOISE, ID 127382.7421875 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Equipment Engineer 3 BOISE, ID 127251 2025 Show Top H1B Job Titles
ASML US LLC Senior Field Service Engineer 3 BOISE, ID 127075 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SENIOR CAD ENGINEER BOISE, ID 127067 2025 Show Top H1B Job Titles
ERNST & YOUNG U.S. LLP Accountants and Auditors - KBGFJG197649-6 BOISE, ID 126922.1171875 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SR FE TD CAPITAL SDM (Supplier Development Manager) BOISE, ID 125502 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SEMICONDUCTOR DESIGN ENGINEER BOISE, ID 125500 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ADVANCED MODELING ENGINEER BOISE, ID 125485 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC PCVD Equipment Engineer BOISE, ID 125000 2025 Show Top H1B Job Titles
Micron Idaho Semiconductor Manufacturing (Triton) LLC Real-Time Defect Analysis Engineer BOISE, ID 125000 2025 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SENIOR SOFTWARE ENGINEER BOISE, ID 125000 2025 Show Top H1B Job Titles
COMPUNNEL SOFTWARE GROUP INC SOFTWARE DEVELOPER BOISE, ID 125000 2025 Show Top H1B Job Titles

Footnotes:

1 Salary was noted as Weekly in DOL records. We are displaying 52 times weekly salary in the salary field.

2 Salary was noted as Bi-Weekly in DOL records. We are displaying 26 times bi-weekly salary in the salary field.

3 Salary was noted as Hourly in DOL records. We are displaying 365x8 times hourly salary in the salary field.

4 Salary was noted as Monthly in DOL records. We are displaying 12 times Monthly salary in the salary field.

5 We weren't able to extract salary information correctly from the in DOL records. Showing it as is.

All other cases salary was mentioned as yearly in DOL records and displayed as is.

All the salaries from DOL records might not include all the bonuses / benefits and other things which are paid. Use these salaries as reference.