Total Records: 6014 - Showing maximum 50 Records per page

H1B Salary Details For BOISE, ID

Records Per Page

H1B Salary Details For BOISE, ID has minimum salary 27000 and maximum salary 445763 from 6014 records.

Employer Job Title City Salary Year
MICRON TECHNOLOGY INC Sr Engineer - Cell BOISE, ID 128598 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Sr Engineer - Cell BOISE, ID 128598 2023 Show Top H1B Job Titles
THE INTERNET TRUCKSTOP LLC SR. SOFTWARE ENGINEER BOISE, ID 128417.75 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC PRINCIPAL PROCESS INTEGRATION ENGINEER BOISE, ID 128000 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SENIOR SOFTWARE ENGINEER BOISE, ID 127960.296875 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Sr. Engineer - Storage & Data Protection BOISE, ID 127908 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SENIOR ENGINEER MDG BOISE, ID 127775 2023 Show Top H1B Job Titles
Micron Idaho Semiconductor Manufacturing (Triton) LLC ID1 Sr Program Manager BOISE, ID 126639.71875 2023 Show Top H1B Job Titles
Micron Idaho Semiconductor Manufacturing (Triton) LLC ID1 Sr Program Manager BOISE, ID 126639.71875 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DOMAIN ARCHITECT BOISE, ID 126544.4375 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DOMAIN ARCHITECT BOISE, ID 126544.4375 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Senior Test Solution Engineer Yield BOISE, ID 126500 2023 Show Top H1B Job Titles
ASML US LLC Product Marketeer 3 BOISE, ID 125800 2023 Show Top H1B Job Titles
ASML US LLC Product Marketeer 3 BOISE, ID 125800 2023 Show Top H1B Job Titles
CRADLEPOINT INC Technical Program Manager Web Operations & Development BOISE, ID 125450 2023 Show Top H1B Job Titles
KLA CORPORATION FIELD SUPPORT MANAGER BOISE, ID 125000 2023 Show Top H1B Job Titles
CRADLEPOINT INC SOFTWARE DEVELOPMENT ENGINEER II BOISE, ID 125000 2023 Show Top H1B Job Titles
KLA CORPORATION FIELD SUPPORT MANAGER BOISE, ID 125000 2023 Show Top H1B Job Titles
KLA CORPORATION FIELD SUPPORT MANAGER BOISE, ID 125000 2023 Show Top H1B Job Titles
THE INTERNET TRUCKSTOP LLC SOFTWARE ENGINEER III BOISE, ID 123614 2023 Show Top H1B Job Titles
THE INTERNET TRUCKSTOP LLC SOFTWARE ENGINEER III BOISE, ID 123614 2023 Show Top H1B Job Titles
THE INTERNET TRUCKSTOP LLC Cloud Database Administrator III BOISE, ID 123359.2265625 2023 Show Top H1B Job Titles
APPLIED MATERIALS INC PROCESS SUPPORT ENGINEER BOISE, ID 123249 2023 Show Top H1B Job Titles
APPLIED MATERIALS INC PROCESS SUPPORT ENGINEER BOISE, ID 123249 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC DATA ENGINEER BOISE, ID 123200 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SUPPLY CHAIN PLANNING MANAGER BOISE, ID 123000 2023 Show Top H1B Job Titles
BOISE STATE UNIVERSITY ASSISTANT PROFESSOR OF MANAGEMENT BOISE, ID 123000 2023 Show Top H1B Job Titles
BOISE STATE UNIVERSITY ASSISTANT PROFESSOR OF MANAGEMENT BOISE, ID 123000 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SUPPLY CHAIN PLANNING MANAGER BOISE, ID 123000 2023 Show Top H1B Job Titles
BOISE STATE UNIVERSITY ASSISTANT PROFESSOR OF MANAGEMENT BOISE, ID 123000 2023 Show Top H1B Job Titles
TOKYO ELECTRON AMERICA INC Engineer Process Senior BOISE, ID 122244.9765625 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC SEMICONDUCTOR PROCESS ENGINEER BOISE, ID 122000 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC IT Solution Architect - PLM BOISE, ID 121890 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC IT Solution Architect - PLM BOISE, ID 121890 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC IT Solution Architect - PLM BOISE, ID 121890 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC IT Solution Architect - PLM BOISE, ID 121890 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Engineer-YE NAND PFA BOISE, ID 121749 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Engineer-YE NAND PFA BOISE, ID 121749 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC NVM PQRA Senior Engineer BOISE, ID 121467.359375 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC NVM PQRA Senior Engineer BOISE, ID 121467.359375 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC R&D Device Characterization Engineer BOISE, ID 120652 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC ENGINEER - NAND CELL BOISE, ID 120000 2023 Show Top H1B Job Titles
APPLIED MATERIALS INC PROCESS SUPPORT ENGINEER BOISE, ID 120000 2023 Show Top H1B Job Titles
APPLIED MATERIALS INC PROCESS SUPPORT ENGINEER BOISE, ID 120000 2023 Show Top H1B Job Titles
Truminds Software Systems Inc SENIOR TECHNICAL LEAD BOISE, ID 120000 2023 Show Top H1B Job Titles
PROLIM CONSULTING INC TEAMCENTER DEVELOPER BOISE, ID 120000 2023 Show Top H1B Job Titles
Truminds Software Systems Inc SENIOR TECHNICAL LEAD BOISE, ID 120000 2023 Show Top H1B Job Titles
PROLIM CONSULTING INC TEAMCENTER DEVELOPER BOISE, ID 120000 2023 Show Top H1B Job Titles
MICRON TECHNOLOGY INC Innovation Engineer Smart Manufacturing and AI BOISE, ID 119025 2023 Show Top H1B Job Titles
ASM AMERICA INC TECHNICAL MANAGER BOISE, ID 118997 2023 Show Top H1B Job Titles

Footnotes:

1 Salary was noted as Weekly in DOL records. We are displaying 52 times weekly salary in the salary field.

2 Salary was noted as Bi-Weekly in DOL records. We are displaying 26 times bi-weekly salary in the salary field.

3 Salary was noted as Hourly in DOL records. We are displaying 365x8 times hourly salary in the salary field.

4 Salary was noted as Monthly in DOL records. We are displaying 12 times Monthly salary in the salary field.

5 We weren't able to extract salary information correctly from the in DOL records. Showing it as is.

All other cases salary was mentioned as yearly in DOL records and displayed as is.

All the salaries from DOL records might not include all the bonuses / benefits and other things which are paid. Use these salaries as reference.